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Imisebenzi ephambili ye-Mirae plug-in machine ibandakanya:
Itekhnoloji yokuqaphela okubonwayo: Isebenzisa umatshini wokubeka umbono wemilomo emithandathu, exhotyiswe ngetekhnoloji yesoftware yokuqaphela, kwaye iqonde ukuma komfanekiso obonakalayo kunye nokulungelelaniswa kwenqwelomoya ngetekhnoloji yokumisa ngokukhawuleza okungayekiyo.
Eyakhelwe-ngaphakathi umsebenzi wokufumanisa i-AOI: Jonga umgangatho wombhalo we-solder oshicilelweyo phambi kokunyuswa, kwaye ujonge ukuchaneka kunye neemposiso zokunyuswa kwe-solder emva kokunyuswa (umsebenzi owuthandayo)
Uyilo lwe-Rebar ephezulu kunye nesezantsi yoxinzelelo: Ibar yentsimbi ephezulu kunye noxinzelelo olusezantsi, ukujija kunye nokuqinisa indlela iqinisekisa ukuba ibhodi yePCB ayizukonakala ngexesha lenkqubo yokunyuka.
Inkqubo yokulinganisa i-high-resolution: Ixhotyiswe ngeeseti ezimbini ze-high-resolution imaging systems, ngokulandelanayo ukubeka ibhodi yePCB, i-CHIP kunye ne-IC.
Izakhono zokubeka i-workpiece ezininzi: Iyakwazi ukuxhoma i-0402-40mm yezixhobo ze-IC, kunye nesantya sokubeka esisiso se-28000CPH
Isixhasi esineendlela ezimbini: Ukuya kuthi ga kwi-80 8mm i-fidders inokubekwa kumacala omabini
Uyilo lwamandla aphantsi: Injini ekhaphukhaphu isetyenziselwa ukunciphisa kakhulu ubunzima benxalenye ehambayo, ngaloo ndlela inciphisa ukusetyenziswa kwamandla omatshini ukuya kwi-1/4 yoomatshini abaqhelekileyo bokubeka.
Ukumiswa kweMagnetic linear motor drive: Itekhnoloji yokumiswa kwemagnethi iyasetyenziswa, ngaphandle kokungqubana okanye ukuchasana ngexesha lentshukumo, isantya esikhawulezayo kunye nobomi obude bebhetri.
Le misebenzi yenza ukuba umatshini we-plug-in we-Mirae agqibezele imisebenzi yokubeka yamacandelo ahlukeneyo ngokufanelekileyo ngexesha lenkqubo yokubeka, kwaye ifanelekile kwiimfuno zemveliso ezizenzekelayo zamacandelo ahlukeneyo e-elektroniki.
