I-TDK yodidi lweshishini loshicilelo lwentloko ye-thermal LH6409AK

I-TDK LH6409AK yi-ultra-high-speed-high-speed industrial-grade head print thermal head eyenzelwe iimeko zoshicilelo oluphezulu ezifana nemigca yemveliso ezenzekelayo, ukuhlelwa kwezinto, kunye neenkqubo zemali. Njengommeli wemveliso ephezulu ye-TDK, idibanisa inani letekhnoloji entsha kwaye ibeka ibhenchmark yeshishini elitsha ngokwesantya soshicilelo, ukuchaneka, kunye nokuthembeka.

2. Imisebenzi emithandathu engundoqo

Injini yoshicilelo enesantya esiphezulu

Ixhasa ushicilelo lwe-300mm/s ultra-high-speed (umyinge weshishini 150-200mm/s)

Ukwamkela iteknoloji yefilimu yokufudumeza i-nano-level, ixesha lokuphendula le-thermal lifutshane ukuya kwi-0.8ms

Imowudi yokugqabhuka inokufikelela kwi-400mm/s (imizuzwana emi-5 ehlala ihleli)

Inkqubo yembuyekezo eguqukayo ekrelekrele

Ukujongwa kwexesha lokwenyani lokuphazamiseka kwendawo nganye yokufudumeza (ukuchaneka ±0.3Ω)

Imbuyekezo ezenzekelayo yokuguquguquka kwamandla ombane (uluhlu ±20%)

Ushicilelo lwegreyscale ukuhambelana kufikelela ΔE<1.2

Uyilo oluzinzileyo lomkhosi

Isubstrate ehlanganisiweyo ye-Ceramic-diamond (i-thermal conductivity 620W/mK)

Kuphumelele isigidi esi-1 sovavanyo lokuqina koomatshini

Ingangenwa luthuli kunye nenqanaba le-IP67

Uluhlu olubanzi lobushushu bemveliso ezinzileyo

Umgangatho wokushisa osebenzayo -40 ℃ ~ 85 ℃

I-algorithm yembuyekezo yeqondo lobushushu eyakhelweyo

Ixesha elibandayo lokuqala <3 imizuzwana (-30℃ okusingqongileyo)

Inkqubo yokuphucula amandla

Uhlengahlengiso lwamandla ombane (ukusetyenziswa kwamandla 0.05W kwimowudi yokugcina amandla)

Ukuchacha kakuhle kombane kunyuke ngama-30%

Iyahambelana ne-ERP Lot6 yomgangatho wokusebenza kwamandla

Intelligent diagnostic interface

Inkxaso ye-RS-485/CAN yonxibelelwano lwebhasi

Ukulayishwa kwexesha langempela leeparamitha ze-12 zokusebenza

Ukuchaneka koqikelelo lwempazamo > 95%

III. Iiparamitha zokusebenza eziphambili

Isalathisi sexabiso leParameter Umgangatho wovavanyo

Isisombululo soshicilelo 203dpi/300dpi ukukhetha ISO/IEC 15415

Ubomi bezinto zokufudumeza izigidi ezili-15 zixhokonxa umgangatho wangaphakathi weTDK

Ukusebenza ngokuqhubekayo ngoku 2.1A@24V (MAX) IEC 62368-1

Shicilela ububanzi 104mm (umgangatho) -

Ixesha lokuphendula lomqondiso 0.5ms (ukusuka kumyalelo ukuya kushushu) MIL-STD-202G

IV. Ukusebenza kwesicelo soshishino

Uvavanyo lwenkqubo yokuhlela yolungiselelo:

I-avareji yokusetyenzwa kwemihla ngemihla yeepakethe ezingama-25,000

Iqondo lokuqatshelwa kwebhakhowudi 99.993%

Ukusetyenziswa kweribhoni yekhabhoni kunyuke nge-27%

Umjikelo wesondlo wandiswa ukuya kwiinyanga ezi-6

Iinzuzo zokumakisha umgca wemveliso yeshishini:

Ixhasa izinto ezahlukeneyo ezifana nentsimbi/iplastiki/iglasi

Ukunganyangeki kokutya kwekhemikhali (ngovavanyo lwe-ISO 2812-2)

Sebenza ngokuzinzileyo kwindawo yengxolo engama-70dB

V. Amagqabantshintshi obuchule obutsha

Itekhnoloji yokulawula intsimi yobushushu obuthathu

Uyilo lwecwecwe lokufudumeza lobusi (inombolo yelungelo elilodwa lomenzi wechiza JP2023-045678)

Ukufana kokusasazwa kobushushu kuphuculwe ngama-40%

Susa ukufiphala emphethweni

Ukuzilungisa umaleko okhuselayo

Ingubo ekhethekileyo equkethe i-nano-silicon particles

Ulungisa ngokuzenzekelayo imikrwelo emincinci

Yandisa ubomi benkonzo ngama-30%

Ukugcinwa kwangaphambili kwe-AI

Ihlalutya imo yokuthwala nge-vibration spectrum

Iqikelela ukusilela koomatshini kwiiyure ezingama-200 kwangaphambili

Idibanisa i-algorithm ye-TDK eyodwa

VI. Izisombululo zokugcina nokuphucula

Uyilo lokutshintshwa kwemodyuli

Ixhasa ukutshintshwa kokutshintsha okushushu (ixesha lokusebenza < 90 imizuzwana)

Inkqubo yokulinganisa ngokuzenzekelayo

Akukho zixhobo zobungcali ezifunekayo

Ukucwangciswa kweFirmware

Ixhasa iigophe ezingwevu ezilungiselelweyo

Ukufudumeza okuhlengahlengiswayo kwi-pulse waveform

Uphuculo olungenazingcingo nge-NFC

VII. Iingcebiso zokukhetha

Iimeko zesicelo ezicetyiswayo:

Iziko lokuhlela le-Express loshicilelo lwetyala elikhawulezayo

Inkqubo yokulandelela iindawo zemoto

Umhla wokupakishwa kokutya kunye noshicilelo lwenombolo yebhetshi

Imveliso yengxelo yezixhobo zovavanyo lwezonyango

Ukuthelekisa inzuzo yokhuphiswano:

I-50% ngokukhawuleza kuneemveliso ezikhuphisanayo

Ukusetyenziswa kwamandla kwehliswe ngama-35%

Iindleko zokugcina zehliswe ngama-40%

Lo mzekelo udlulise izatifikethi ezininzi ezifana ne-UL / CE / ISO 9001 / ISO 13485, kwaye inesabelo semarike ye-32% kwimarike yezixhobo zokusebenza ezizenzekelayo (idatha ye-2024). Ubuchwephesha bayo obukhethekileyo bokulawula ubushushu buyenza ikwazi ukugcina imveliso ezinzileyo kwindawo enomahluko omkhulu wobushushu, iyenze ibe lolona khetho lufanelekileyo lokutshintsha oomatshini bekhowudi be-laser bendabuko.